Semiconductor packages and methods of packaging semiconductor devices

A method of forming a semiconductor package comprising:

• providing a conductive base carrier having at least a conductive line level with conductive traces separated by spaces defined on a first surface of the base carrier;
• forming a first dielectric layer on the first surface, the first dielectric layer filling the spaces and covering portions of the conductive traces while leaving portions of the first surface exposed;
• mounting a die on the first surface of the base carrier, the die having die contacts being coupled to the exposed first surface of the base carrier;
• encapsulating the die with a cap;
• patterning the second surface of the base carrier;
• forming a second dielectric layer with openings which exposes portions of the patterned second surface of the base carrier;
• and
• forming package contacts which conductively interconnected to the die contacts.

A method of forming a semiconductor package comprising:

• providing a conductive base carrier having at least a conductive line level with conductive traces separated by spaces defined on a first surface of the base carrier;
• mounting a die on the first surface of the base carrier, the die having die contacts being coupled to the first surface of the base carrier;
• encapsulating the die with a cap;
• patterning the second surface of the base carrier;
• forming a dielectric layer with openings which exposes portions of the patterned second surface of the base carrier;
• and
• forming package contacts which conductively interconnected to the die contacts.

A method of forming a semiconductor package comprising:

• providing a conductive base carrier having first and second surfaces;
• mounting a die on the first surface of the base carrier, the die having die contacts being coupled to the first surface of the base carrier;
• encapsulating the die with a cap;
• patterning the second surface of the base carrier;
• forming a dielectric layer with openings which exposes portions of the patterned second surface of the base carrier;
• and
• forming package contacts which conductively interconnected to the die contacts.