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AssigneeOMG Electronic Chemicals, Inc.
InventorsRichard Bellemare, Denis Morrissey, Anthony Piano
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The present technology generally relates to methods for metallizing an aluminum paste comprising contacting the aluminum paste with a cleaner, contacting the aluminum paste with an oxidation inhibiting deposit solution to deposit a layer of an oxidation inhibiting composition onto the aluminum paste and contacting the aluminum paste with conductive metal deposit solution to deposit a layer of a conductive metal onto the aluminum paste. Specifically, the present technology includes methods metallizing an aluminum paste comprising contacting the aluminum paste with an acidic cleaner, contacting the aluminum paste with an acid zincate solution to deposit zinc onto the aluminum paste and contacting the aluminum paste with an electroless nickel deposit solution to coat the aluminum paste with a nickel-phosphorus layer.
A method of metallizing an aluminum paste on a substrate, comprising:
A method of metallizing an aluminum paste on a substrate, comprising:
Dependencies are inferred from the claim text.