Semiconductor manufacturing apparatus and manufacturing method of semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorsYumi NAKAJIMA, Kentaro MATSUNAGA, Eiji YONEDA
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AssigneeKabushiki Kaisha Toshiba
InventorsYumi NAKAJIMA, Kentaro MATSUNAGA, Eiji YONEDA
Estimating the term…
A semiconductor manufacturing apparatus according to the present embodiment includes a vacuum chamber. A stage mounts a semiconductor substrate thereon within the vacuum chamber. An electrostatic chuck fixes the semiconductor substrate onto the stage. A sensor detects a height of a surface of the semiconductor substrate fixed onto the stage by the electrostatic chuck. A processor determines whether the surface of the semiconductor substrate is distorted based on the height of the surface of the semiconductor substrate. The processor calculates correction values for a pattern transferred onto the surface of the semiconductor substrate by exposure based on the height of the surface of the semiconductor substrate when the surface of the semiconductor substrate is distorted. An exposure part exposes the surface of the semiconductor substrate to light using the correction values.
A semiconductor manufacturing apparatus comprising:
A manufacturing method of a semiconductor device using a semiconductor manufacturing apparatus comprising an electrostatic chuck fixing a semiconductor substrate onto a stage within a vacuum chamber, a sensor detecting a height of a surface of the semiconductor substrate, a processor calculating correction values in order to correct a distortion of a pattern transferred onto the surface of the semiconductor substrate by exposure, and an exposure part exposing the surface of the semiconductor substrate to light using the correction values, the method comprising:
Dependencies are inferred from the claim text.