Process for forming metal film, and product equipped with metal film
AssigneesKunio Mori, Sulfur Chemical Institute Incorporated, Meiko Electronics Co., Ltd.
InventorsKunio MORI, Yusuke MATSUNO, Katsuhito MORI, Takahiro KUDO, Shigeru MICHIWAKI, Manabu MIYAWAKI
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Abstract
The purpose of the present invention is to provide a wiring substrate from which a metal film cannot be detached easily. A process for forming a metal film comprises a step (X) of applying an agent containing a compound (α) onto the surface of a base and a step (Y) of forming a metal film on the surface of the compound (α) by a wet-mode plating technique, wherein the compound (α) is a compound having either an OH group or an OH-generating group, an azide group and a triazine ring per molecule, and the base comprises a polymer.
Claims13
A product equipped with a metal film, comprising:
- a base,
- the following compound (α) applied onto the surface of said base;
- and
- a wet-type plating metal film formed on said compound (α):
- wherein said compound (α) is a compound having at least one OH group or at least one OH yielding group, at least one azide group, and at least one triazine ring per molecule;
- and
- wherein said base is configured by employing a polymer.
The product equipped with the metal film according to claim 17, said product being a wiring substrate.
Dependencies are inferred from the claim text.