Resin composition, prepreg, and laminate
AssigneeMitsubishi Gas Chemical Company, Inc.
InventorsTakaaki Ogashiwa, Hiroshi Takahashi, Tetsuro Miyahira, Yoshihiro Kato
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Abstract
It is an object of the present invention to provide, without using a halogenated compound or a phosphorus compound, a resin composition for printed wiring boards, a prepreg, a laminate, and a metal foil-clad laminate, each of which has high-degree flame retardance, has a low water absorption ratio and a high glass transition temperature, and has a high elastic modulus at high temperature. A resin composition according to the present invention includes a specific maleimide compound (A); a cyanate ester compound (B); a non-halogen epoxy resin (C); and an inorganic filler (D).
Claims35
A resin composition comprising:
- a maleimide compound (A) represented by general formula (1):
- wherein R represents a hydrogen atom or a methyl group, and n represents an integer of 1 to 10 on average;
- a cyanate ester compound (B);
- a non-halogen epoxy resin (C);
- and
- an inorganic filler (D).
A resin composition comprising:
- a non-halogen epoxy resin (C);
- an inorganic filler (D);
- and
- a BT resin (E) obtained by prepolymerizing a maleimide compound (A) and a cyanate ester compound (B), the maleimide compound (A) represented by general formula (1):
- wherein R represents a hydrogen atom or a methyl group, and n represents an integer of 1 to 10 on average.
Dependencies are inferred from the claim text.