Method of punching out a damper from a damper material having a constraint layer, punching apparatus used for the method, and attaching apparatus with the punching apparatus
AssigneeNHK Spring Co., Ltd.
InventorAkio MASHIMA
Life of this patent
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Abstract
A method punches out a damper from a damper material set on a punching stage with use of a hollow punch so that the punched damper is positioned within a hollow inside of the punch while vibrating a member composing the punching stage on which the damper material is set at the high frequency. The damper material includes a viscoelastic body layer and the constraint layer laminated on the viscoelastic body layer and the viscoelastic body layer includes an attaching surface through which the damper material is detachably attached on the liner.
Claims8
A method of punching out a damper from a damper material set on a punching stage with use of a hollow punch, the damper material including a viscoelastic body layer and a constraint layer laminated on the viscoelastic body layer, the viscoelastic body layer including an attaching surface through which the damper material is detachably attached on an exfoliative member, the method comprising:
- punching out the damper from the damper material so that the punched damper is positioned within a hollow inside of the punch while vibrating a member composing the punching stage on which the damper material is set at high frequency.
Dependencies are inferred from the claim text.