Epoxy composition and epoxy resin molded article

An epoxy composition comprising:

• at least one epoxy monomer selected from the group consisting of epoxy monomers represented by the following general formulae (1) to (4);
• and
• a phenolic curing agent represented by the following general formula (5) or a phenolic curing agent represented by the following general formula (6),
• G—X1—A—X2—G (1)
• G—X3—A—X4—A′—X5—G (2)
• G—X5—A′—X7—A—X8—G (3)
• G—X9—A—X10—A—X11—G (4)
• in which G represents a glycidyloxy group, X1 to X11 each represents a substituted or unsubstituted phenylene represented by the following general formula (x), and X1 to X11 may be the same or different from one another,
• in which R1 to R4 are each a methyl group, an ethyl group, a propyl group or a hydrogen atom, and R1 to R4 may be the same or different from one another, and
• further, A and A′ represent azomethine groups represented by the following general formulae (a) and (a′), respectively,
• in which R5 to R16 are each a methyl group, an ethyl group, a propyl group or a hydrogen atom, at least one of R5 to R16 is any one of a methyl group, an ethyl group and a propyl group, and R5 to R16 may be the same or different from one another,
• in which R17 is a hydroxyl group, a methyl group, an ethyl group, a propyl group or a hydrogen atom, Ph1, Ph2 and Ph3 each represents substituted phenyl represented by the following general formula (p), and Ph1 to Ph3 may be the same or different from one another,
• in which R18 to R22 are each a hydroxyl group, a methyl group, an ethyl group, a propyl group or a hydrogen atom, and at least one of R18 to R22 is a hydroxyl group.