Wafer polishing apparatus and method
AssigneeEbara Corporation
InventorsTetsuji TOGAWA, Atsushi YOSHIDA, Toshifumi WATANABE
Life of this patent
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Abstract
An apparatus and method of polishing a substrate is described. The polishing includes: rotating a substrate; pressing a first polishing tool against an edge portion of the substrate to polish the edge portion; and pressing a second polishing tool against the edge portion of the substrate to polish the edge portion. The second polishing tool is located more inwardly than the first polishing tool with respect to a radial direction of the substrate. The first polishing tool has a polishing surface rougher than a polishing surface of the second polishing tool.
Claims20
A method of manufacturing a semiconductor, comprising:
- rotating a semiconductor wafer;
- applying a first polishing tool against an edge portion of the semiconductor wafer to polish the edge portion;
- and
- applying a second polishing tool against the edge portion of the semiconductor wafer to polish the edge portion, the second polishing tool being located more inwardly than the first polishing tool with respect to a radial direction of the semiconductor wafer,
- the first polishing tool having a polishing surface more abrasive than a polishing surface of the second polishing tool.
A substrate polishing apparatus, comprising:
- a substrate holder configured to rotate the substrate;
- a first polishing tool configured to press against an edge portion of the substrate to polish the edge portion;
- and
- a second polishing tool configured to press against the edge portion of the substrate to polish the edge portion, the second polishing tool being located more inwardly than the first polishing tool with respect to a radial direction of the substrate,
- the first polishing tool having a polishing surface more abrasive than a polishing surface of the second polishing tool.
A method of manufacturing a semiconductor, comprising:
- rotating a substrate;
- pressing a first polishing tool against an edge portion of the substrate to polish the edge portion;
- and
- pressing a second polishing tool against the edge portion of the substrate to polish the edge portion, the second polishing tool being located more inwardly than the first polishing tool with, respect to a radial direction of the substrate,
- the first polishing tool having a polishing surface rougher than a polishing surface of the second polishing tool.
Dependencies are inferred from the claim text.