Polishing apparatus and polishing method
AssigneeEbara Corporation
InventorsMasaya SEKI, Tetsuji TOGAWA
Life of this patent
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Abstract
A polishing apparatus is used for polishing a substrate such as a semiconductor wafer. The polishing apparatus includes a substrate holder to hold a substrate and to rotate the substrate, a pressing member configured to press a polishing tool against the substrate and to polish the substrate, a pressing force control mechanism configured to control a pressing force of the pressing member, and a polishing position limiting mechanism configured to limit a polishing position of the pressing member. A polishing tape or a fixed abrasive is used as the polishing tool.
Claims15
A polishing apparatus for polishing a substrate, comprising:
- a substrate holder configured to hold a substrate and to rotate the substrate;
- a pressing member configured to press a polishing tool against the substrate and to polish the substrate;
- a pressing force control mechanism configured to control a pressing force of the pressing member;
- and
- a polishing position limiting mechanism configured to limit a polishing position of the pressing member.
A polishing apparatus for polishing a substrate, comprising:
- a substrate holder to hold a substrate and to rotate the substrate;
- a pressing member to press a polishing tool against the substrate and to polish the substrate;
- an actuator to control a pressing force of the pressing member;
- and
- a position limiter to limit a polishing position of the pressing member.
A polishing method of polishing a substrate, comprising:
- moving a stopper from a predetermined initial position by a distance corresponding to a target polishing amount of a substrate;
- pressing a polishing tool against the substrate by a pressing member while rotating the substrate;
- and
- polishing the substrate until a positioning member which moves together with the pressing member is brought into contact with the stopper.
A polishing method of polishing a substrate, comprising:
- bringing a positioning member, which moves together with a pressing member, into contact with a stopper;
- and
- polishing the substrate by pressing a polishing tool against the substrate by the pressing member while moving the pressing member and the stopper integrally at a predetermined speed with the positioning member and the stopper being in contact with each other while rotating the substrate.
Dependencies are inferred from the claim text.