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US 2014/0213153 A1Published application
Wafer Polishing Tool Using Abrasive Tape
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsTang-Kuei Chang, Kuo-Hsiu Wei, Kei-Wei Chen, Wei-Jen Lo, Ying-Lang Wang
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Abstract
An embodiment wafer polishing tool includes an abrasive tape, a polish head holding the abrasive tape, and a rotation module. The rotation module is configured to rotate a wafer during a wafer polishing process, and the polish head is configured to apply pressure to the abrasive tape toward a first surface of the wafer during the wafer polishing process.
Claims20
A wafer polishing tool, comprising:
- an abrasive tape;
- a polish head holding the abrasive tape;
- and
- a rotation module, wherein the rotation module is configured to rotate a wafer during a wafer polishing process, and wherein the polish head is configured to apply pressure to the abrasive tape toward a first surface of the wafer during the wafer polishing process.
1 more element
A method for wafer polishing, comprising:
- placing a wafer on a rotation module;
- rotating the wafer with the rotation module;
- and
- polishing a first surface by a wafer by applying an abrasive tape against the first surface of the wafer with a polishing head.
1 more element
A wafer polishing tool, comprising:
- a diamond tape comprising diamond powder bonded to a base tape;
- a polishing head holding the diamond tape;
- and
- a rotation module, wherein the rotation module is configured to rotate a wafer during a wafer polishing process, and wherein the polishing head is configured to apply pressure on the diamond tape to position the diamond tape against the wafer during the wafer polishing process.
1 more element
Dependencies are inferred from the claim text.