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US 2014/0213152 A1Published application
Wafer Edge Trimming Tool Using Abrasive Tape
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsTang-Kuei Chang, Kuo-Hsiu Wei, Kei-Wei Chen, Huai-Tei Yang, Ying-Lang Wang
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Abstract
A wafer edge trimming tool includes an abrasive tape and a holding module configured to hold the abrasive tape against portions of an edge of a rotating wafer during a wafer edge trimming process.
Claims20
A wafer edge trimming tool, comprising:
- an abrasive tape;
- and
- a holding module configured to hold the abrasive tape against portions of an edge of a rotating wafer during a wafer edge trimming process.
A method of wafer edge trimming, comprising:
- rotating a wafer;
- and
- trimming an edge of the wafer by rotating the edge of the wafer against an abrasive tape.
A wafer edge trimming tool, comprising:
- a diamond tape including diamond powder bonded to a base film;
- a holding module;
- a polishing head configured to hold the diamond powder of the diamond tape against an edge of a wafer during a wafer edge trimming process;
- and
- a rotation module configured to rotate the wafer, wherein the diamond tape is held over the edge of the wafer by the holding module.
2 more elements
Dependencies are inferred from the claim text.