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US 2014/0213018 A1Published application
Method for formng a semiconductor device assembly having a heat spreader
AssigneeFreescale Semiconductor, Inc.
InventorsLeo M. Higgins III, Burton J. Carpenter
Life of this patent
Estimating the term…
Abstract
A method includes providing an integrated circuit (IC) die assembly that includes a substrate and an IC die mounted on a portion of a major surface of the substrate, dispensing an interface material on the IC die, positioning a portion of a heat spreader in contact with the interface material, and dispensing an adhesive between one side of the heat spreader facing the IC die assembly and exposed portions of a major surface of an encapsulant on the substrate.
Claims20
A method comprising:
- providing an integrated circuit (IC) die assembly that includes a substrate and an IC die mounted on a portion of a major surface of the substrate;
- dispensing a thermal interface material on the IC die;
- positioning a portion of a heat spreader in contact with the thermal interface material;
- and
- dispensing an adhesive between one side of the heat spreader facing the IC die assembly and exposed portions of a major surface of an encapsulant on the substrate.
2 more elements
A method comprising:
- attaching a semiconductor die to a substrate;
- forming wire bonds between the die and the substrate;
- encapsulating the wire bonds with a mold compound, wherein the mold compound is configured to expose a top surface of the die that does not include the wire bonds;
- applying a first adhesive over the top surface of the die;
- contacting a portion of a heat spreader to the first adhesive;
- and
- dispensing a second adhesive so that the second adhesive fills a gap between a first side of the mold compound and a first side of the heat spreader.
4 more elements
A method comprising:
- applying a first interface material on an exposed portion of an integrated circuit (IC) die mounted on a substrate;
- mounting a first portion of a heat spreader on the IC die using an interface material, the heat spreader having an opening through a second portion of the heat spreader that is outside of the first portion of the heat spreader;
- and
- dispensing an adhesive between a first side of the heat spreader and a surface of an encapsulant on the substrate, wherein the interface material is different than the adhesive.
1 more element
Dependencies are inferred from the claim text.