Method of fabricating semiconductor device
AssigneeSamsung Electronics Co., Ltd.
InventorsJong-Youn KIM, Ji-Hwang KIM, Hae-Jung YU, Cha-Jea JO
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Abstract
A method of fabricating a semiconductor device includes attaching a semiconductor substrate to a carrier using a carrier fixing layer, where the semiconductor substrate including a plurality of semiconductor chips. The method further includes forming gaps between adjacent ones of the chips. The gaps may be formed using one or more chemicals or light which act to remove portions of the semiconductor substrate to expose the carrier fixing layer. Additional portions of the carrier fixing layer are then removed to allow for removal of the chips from the carrier.
Claims20
A method of fabricating a semiconductor device comprising:
- attaching a semiconductor substrate to a carrier using a carrier fixing layer, the semiconductor substrate including a plurality of first semiconductor chips;
- forming gaps between adjacent ones of the first semiconductor chips;
- and
- filling the gaps with one or more chemicals to remove portions of the carrier fixing layer exposed in respective ones of the gaps.
A method of fabricating a semiconductor device comprising:
- attaching a semiconductor substrate to a carrier using a carrier fixing layer, the semiconductor substrate including a plurality of semiconductor chips;
- forming gaps between adjacent ones of the first semiconductor chips;
- and
- forming first separation spaces in portions of the carrier fixing layer corresponding to the gaps, the forming the first separation spaces including removing portions of the carrier fixing layer interposed between the carrier and the semiconductor chips.
Dependencies are inferred from the claim text.