Manufacturing method of semiconductor device

A manufacturing method of a semiconductor device comprising the steps of:

• (a) providing a wiring substrate having an upper surface and a lower surface opposite to the upper surface;
• (b) mounting a sensor chip having a first major surface, a sensor region formed on the first major surface, a plurality of pixels formed in the sensor region, and a first rear surface opposite to the first major surface, on the upper surface of the wiring substrate so that the first rear surface faces the upper surface of the wiring substrate;
• (c) disposing a first adhesive at a plurality of positions on the first major surface of the sensor chip;
• (d) after the step (c), forming a plurality of first spacers on the first major surface of the sensor chip by curing the first adhesive;
• (e) after the step (d), disposing a second adhesive in a paste state on the first major surface of the sensor chip;
• (f) after the step (e), disposing a first optical component having a light blocking layer in which a plurality of optical regions is formed, over the first major surface of the sensor chip via the first spacers and the second adhesive;
• and
• (g) after the step (f), curing the second adhesive,
• wherein the step (e) forms the second adhesive to be of greater height than each of the first spacers,
• the step (f) disposes the first optical component over the first major surface of the sensor chip while applying a load to the first optical component, and
• the step (g) cures the second adhesive in a state of not applying a load to the first optical component.