Method for manufacturing light emitting device package

A method of manufacturing a light emitting device package, comprising:

• preparing a growth substrate comprising a plurality of light emitting device groups formed on a top surface of the growth substrate;
• preparing a first package substrate having a first bonding pattern corresponding to first light emitting device groups that are not adjacent to one another among the plurality of light emitting device groups, the first bonding pattern being formed on a top surface of the first package substrate;
• bonding the first light emitting device groups and the first bonding pattern by disposing the top surface of the growth substrate to face the top surface of the first package substrate;
• separating the first light emitting device groups from the growth substrate;
• preparing a second package substrate having a second bonding pattern corresponding to second light emitting device groups that are not adjacent to one another among the plurality of light emitting device groups remaining in the growth substrate, the second bonding pattern being formed on a top surface of the growth substrate;
• bonding the second light emitting device groups and the second bonding pattern by disposing the top surface of the growth substrate to face the top surface of the second package substrate;
• and
• separating the second light emitting device groups from the growth substrate.

A method of manufacturing a light emitting device package, comprising:

• preparing a growth substrate comprising a plurality of first light emitting devices and a plurality of second light emitting devices disposed on a top surface of the growth substrate;
• preparing a first package substrate having a first bonding pattern corresponding to the plurality of first light emitting devices, the bonding pattern being disposed on a top surface of the first package substrate, wherein a top surface of the bonding pattern extends above the top surface of the first package substrate;
• bonding the plurality of the first light emitting devices and the first bonding pattern by disposing the top surface of the growth substrate to face the top surface of the first package substrate and applying sufficient heat to bond the first light emitting devices to the first bonding pattern;
• separating the plurality of first light emitting devices from the growth substrate;
• forming a lens surrounding each of the plurality of first light emitting devices;
• and
• separating portions of the first package substrate from each other, each portion containing a light emitting device.