Resin application apparatus, optical property correction apparatus and method, and method for manufacturing led package
AssigneeSamsung Electronics Co., Ltd.
InventorsSang Bok YOON, Hae Yong EOM, Mi Hwa YOU, Seung Min HONG, Sang Hoon LEE, Yong Gu KIM
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Abstract
A resin application apparatus includes: an optical property measurement unit measuring an optical property of light emitted from a light emitting diode (LED) chip which is mounted on a package body and to which transparent resin is not applied; and a resin application unit applying light conversion material-containing transparent resin to the LED chip in accordance with a resin application amount which is decided depending on the optical property measured by the optical measurement unit.
Claims21
1-43. (canceled)
A method for manufacturing an LED package, comprising:
- attaching LED chips to a plurality of package bodies of a package array having a structure in which the plurality of package bodies are arranged, a positive electrode and a negative electrode of each package body in the package array being electrically isolated from each other;
- forming a plurality of LED packages by dispensing phosphor-containing resin to the respective package bodies having the LED chip attached thereto;
- inspecting the optical properties of the respective LED packages in a state in which a voltage is applied to the respective LED chips of the package array to emit light;
- and
- singulating the LED packages by separating the LED packages from the package array.
A method for manufacturing an LED package, comprising:
- attaching at least one of LED chips to at least one of package bodies of a package array having a structure in which a positive electrode and a negative electrode of each package body in the package array are electrically isolated from each other;
- forming at least one of LED packages by dispensing phosphor-containing resin to the package bodies having the LED chip attached thereto;
- inspecting the optical properties of the LED packages in a state in which a voltage is applied to the LED chip of the package array to emit light;
- and
- singulating the LED packages from the package array.
Dependencies are inferred from the claim text.