Method for forming bonded structures and bonded structures formed thereby
OwnerAndrew John Syvret, Sylvain Pujolinventors
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Abstract
A method of forming a bonded structure (10), such as for use in an automobile structure, comprises providing a first substrate (14) and a second substrate (16), and adding an adhesive region between the substrates, wherein the adhesive region has a first adhesive portion (18) and a second adhesive portion (12), and curing the first adhesive portion more quickly than the second adhesive portion, the method including positioning the substrates relative to one another and injecting the adhesive between said substrates to form an adhesive region while holding the substrates relative to one another.
Claims38
A method of forming a bonded structure comprising:
- providing a first substrate and a second substrate,
- adding an adhesive region between the substrates, wherein the adhesive region has a first adhesive portion and a second adhesive portion, and
- curing the first adhesive portion more quickly than the second adhesive portion.
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A method of forming a bonded structure comprising
- providing a first substrate and a second substrate, and
- positioning the substrates relative to one another, applying adhesive to surfaces of the substrates by injecting the adhesive between the surfaces of the substrates to form an adhesive region while holding the substrates relative to one another.
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A bonded structure comprising a first substrate and a second substrate bonded together by an adhesive region, wherein the adhesive region includes a first adhesive portion and a second adhesive portion, the first adhesive portion containing faster cure adhesive than the second adhesive portion.
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Dependencies are inferred from the claim text.