Curable resin compositions
AssigneeDow Global Technologies LLC
InventorsAngela I. Padilla-Acevedo, Ludovic Valette, Michael J. Mullins, Kandathil E. Verghese, Mark B. Wilson
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Abstract
A solvent-free curable epoxy resin composition including (a) at least one divinylarene dioxide; and (b) at least one hardener; wherein the solvent-free curable epoxy resin composition is substantially free of solvent and has at least two exotherm peaks and wherein the exothermic peak difference of the two exotherm peaks is sufficient to allow the curable solvent-free epoxy resin composition of being B-staged.
Claims17
A solventless curable epoxy resin composition comprising (a) at least one divinylarene dioxide;
- and (b) at least one hardener;
- wherein the solventless curable epoxy resin composition is solvent-free;
- wherein the solventless curable epoxy resin composition has at least two exotherm peaks;
- and wherein the exothermic peak difference of the two exotherm peaks is sufficient to allow the solventless curable epoxy resin composition of being B-staged.
The process of claim 17, including step (iii) fully curing the prepreg of step (ii) to form a laminate.
Dependencies are inferred from the claim text.