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US 2014/0212085 A1Published application
Optocoupler
OwnerGeorgios Margaritisinventor
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OwnerGeorgios Margaritisinventor
Estimating the term…
A novel optocoupler is disclosed that includes at least one light emitting chip attached to one side of an optically transparent substrate and a photodetector chip attached to the opposite side of the optically transparent substrate. The light emitting chip receives electrical signals that are converted to light signals that are transmitted through the optically transparent substrate and are received and converted to electrical signals by the photodetector on the opposite side of the substrate. Further, a method to manufacture an optocoupler is disclosed where a light emitting chip is flip chip attached to one side of an optically transparent substrate with the light emitting surface of the chip facing the transparent substrate and a photodetector is flip chip attached to the opposite side of the optically transparent substrate, with the receiving surface of the chip facing the optically transparent substrate.
An optocoupler comprising a light emitting chip receiving electrical signals from a transmitting electronic circuit and a photodetector chip sending electrical signals to a receiving electronic circuit and an optically transparent substrate with at least two opposite flat sides and wherein the light emitting chip is attached to the first of the two opposite sides of the substrate with the light emitting surface of the light emitting chip facing the substrate and wherein the photodetector chip is attached to the second of the two opposite sides of the substrate with the light receiving surface of the photodetector chip facing the substrate and wherein the light emitting chip and photodetector chip are positioned in a manner that allows the light emitted by the light emitting chip to be received by the photodetector chip.
A method to make an optocoupler including the steps of:
Dependencies are inferred from the claim text.