Structure and method for manufacturing the same
AssigneeCanon Kabushiki Kaisha
InventorsYutaka Setomoto, Takayuki Teshima
Life of this patent
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Abstract
A method for manufacturing a structure by using a silicon mold, in which disturbances in arrangement due to charges are reduced, can be provided. The method for manufacturing a structure includes the steps of forming a recessed portion in a silicon substrate, cleaning, drying, or conveying the silicon substrate while charges of a plurality of portions sandwiched between the recessed portion are removed, and filling a metal into the recessed portion of the silicon substrate subjected to the cleaning, drying, or conveying.
Claims17
A method for manufacturing a structure, comprising the steps of:
- forming a recessed portion in a silicon substrate;
- cleaning, drying, or conveying the silicon substrate while charges of a plurality of portions sandwiched between the recessed portion are removed;
- and
- filling a metal into the recessed portion of the silicon substrate subjected to the cleaning, drying, or conveying.
A structure comprising:
- a plurality of convex portions disposed on a first surface of a silicon substrate;
- and
- a metal body disposed in at least part of portion between the plurality of convex portions,
- wherein the aspect ratios of the plurality of convex portions are 20 or more and 200 or less, and
- the incidence of sticking of the plurality of convex portions is 0% or more and 3% or less.
A structure comprising:
- a silicon substrate provided with a plurality of recessed portions in a first surface;
- and
- a metal body disposed in at least part of the plurality of recessed portions,
- wherein the aspect ratio of each of the plurality of recessed portions are 20 or more and 200 or less, and
- the incidence of sticking of the portions sandwiched between the plurality of recessed portions is 0% or more and 3% or less.
A metal body made from gold or an alloy thereof, comprising a plurality of holes having an aspect ratio of 20 or more, wherein the incidence of sticking of the plurality of holes is 0% or more and 3% or less.
Dependencies are inferred from the claim text.