Wireless apparatus and method for manufacturing same
AssigneePanasonic Corporation
InventorTakayuki Tsukizawa
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Abstract
A wireless apparatus has a board, a power amplifier high-frequency IC chip, and a process variations detector. The process variations detector monitors a circuit characteristic variation amount due to process variations. An underfill having a parameter value calculated using the monitored circuit characteristic variation amount is applied between the board and the high-frequency IC chip and the mounting board. As a result, the wireless apparatus exhibits a desired circuit characteristic even with process variations and influence of the underfill.
Claims12
A wireless apparatus comprising:
- a mounting board;
- a high-frequency IC chip which is flip-chip-mounted on the mounting board;
- and
- an underfill which is applied between the high-frequency IC chip and the mounting board,
- wherein the high-frequency IC chip includes a device unit which constitutes a main circuit and a process variations detector that detects a process variation of the high-frequency IC chip;
- and
- wherein the underfill has a parameter value that corresponds to the detected process variation.
A method for manufacturing a wireless apparatus, comprising the steps of:
- manufacturing a high-frequency IC chip having a process variations detector and a device unit that constitutes a main circuit;
- detecting a process variation of the high-frequency IC chip using the process variations detector;
- and
- mounting the high-frequency IC chip on a mounting board by applying an underfill having a parameter value that corresponds to data detected by the detecting step.
Dependencies are inferred from the claim text.