Component built-in board mounting body and method of manufacturing the same, and component built-in board

A method of manufacturing a component built-in board mounting body, the component built-in board mounting body having a component built-in board mounted on a mounting surface of a mounting board, the component built-in board being configured having stacked therein a plurality of printed wiring bases that each have a wiring pattern and a via formed on/in a resin base thereof, and the component built-in board being configured having a first electronic component built in thereto and a second electronic component surface-mounted thereon, the method comprising the steps of:

• forming the wiring pattern including thermal wiring and the via including a thermal via in a plurality of the resin bases, and forming in at least one of the plurality of resin bases an opening where the first electronic component is built in, thereby forming the plurality of printed wiring bases;
• collectively stacking the plurality of printed wiring bases by thermal compression bonding such that an electrode of the first electronic component built in to the opening is connected to the wiring pattern via the via, and a surface on an opposite side to a formation surface of the electrode is connected to the thermal wiring via the thermal via, thereby forming the component built-in board;
• forming on one of surface layers of the component built-in board a first bump connected to the thermal wiring on a side of the surface on the opposite side to the formation surface of the electrode, and forming on the other of the surface layers of the component built-in board a second bump connected to the wiring pattern on a side of the electrode;
• and
• mounting the second electronic component on the component built-in board via the second bump, and mounting the component built-in board on the mounting surface of the mounting board via the first bump.

A method of manufacturing a component built-in board mounting body, the component built-in board mounting body having a component built-in board mounted on a mounting surface of a mounting board, the component built-in board being configured having stacked therein a plurality of printed wiring bases that each have a wiring pattern and a via formed on/in a resin base thereof, and the component built-in board being configured having an electronic component built in thereto, the method comprising the steps of:

• forming the wiring pattern including thermal wiring and the via including a thermal via in a plurality of the resin bases such that the thermal wiring and the thermal via, excluding a portion thereof, are disposed on an outer peripheral side of the electronic component, and forming in at least one of the plurality of resin bases an opening where the electronic component is built in, thereby forming the plurality of printed wiring bases;
• collectively stacking the plurality of printed wiring bases by thermal compression bonding such that a surface on an opposite side to an electrode formation surface of the electronic component is connected to the thermal wiring via the thermal via, and is connected to a surface layer of the component built-in board via the thermal wiring and the thermal via disposed on the outer peripheral side of the electronic component, thereby forming the component built-in board;
• forming on the surface layer of the component built-in board a bump connected to the thermal wiring;
• and
• mounting the component built-in board on the mounting surface of the mounting board via the bump.