Consolidated thermal module
AssigneeApple Inc.
InventorsBrett W. Degner, Gregory Tice
Life of this patent
Estimating the term…
Abstract
A low profile heat removal system suitable for removing excess heat generated by an integrated circuit operating in a compact computing environment is disclosed.
Claims21
-20. (canceled)
A consolidated thermal module (CTM) used to secure an integrated circuit (IC) to a socket disposed on a first surface of a printed circuit board (PCB) and to maintain the IC in thermal contact with a heat removal assembly comprising:
- a stiffener plate disposed on a second surface of the PCB;
- a retaining mechanism disposed on the stiffener plate;
- and
- at least one fastener used to secure the heat removal assembly to the stiffener plate and the retaining mechanism, wherein the retaining mechanism evenly distributes a retaining force across the stiffener plate that maintains the IC in uniform electrical contact with electrical contacts within the socket and maintains the IC in thermal contact with the heat removal assembly.
A computing device, comprising:
- a heat transfer assembly having a thermal transport positioned on a first portion of a printed circuit board, the thermal transport engaged with an integrated circuit;
- a spring element positioned on a second portion of the printed circuit board opposite the first portion, the spring element having a first attachment point, wherein the spring element bends at the first attachment point to exert a force on a plate such that the plate is maintained in contact with the printed circuit board;
- wherein the force from the spring element maintains the integrated circuit in thermal contact with the heat transfer assembly;
- and
- wherein the force from the thermal transport maintains the integrated circuit seated in electrical contact with the printed circuit board.
The computing device as recited in 30, wherein the spring element includes a plurality of extensions and a plurality of fastener attachment points.
The computing device as recited in 33, wherein the plurality of extensions bend with respect to a central portion of the spring element.
A consolidated thermal module (CTM) for securing and cooling an integrated circuit (IC) mounted to a printed circuit board (PCB), comprising:
- a heat removal assembly disposed on a first surface of the PCB and in thermal contact with the IC, comprising:
- a thermally conductive casting;
- and
- a heat transfer conduit capable of transporting heat from the IC;
- a plate disposed on a second surface of the PCB, the second surface opposite the first surface;
- and
- a retaining mechanism disposed on a portion of the plate, wherein the retaining mechanism secures the thermally conductive casting and the plate to the PCB by evenly distributing a retaining force across the plate, the retaining force capable of maintaining the IC in thermal contact with the heat transfer conduit.
Dependencies are inferred from the claim text.