Method of manufacturing electronic device, electronic device, electronic apparatus, and moving object
AssigneeSeiko Epson Corporation
InventorsShinya AOKI, Juichiro MATSUZAWA, Osamu KAWAUCHI, Masaru MIKAMI
Life of this patent
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Abstract
A method of manufacturing an electronic device in which an inner space for housing a gyro element is formed between a base and a lid and the base and the lid are bonded includes bonding the base and the lid in which a groove is provided on a surface to be bonded with the base so that the inner space communicates with the outside by not bonding the inner surface of the groove to the base and to position the groove around a concave portion provided on a side surface of the base, and closing a communication portion by irradiating a laser beam to the lid in the communication portion.
Claims17
A method of manufacturing an electronic device in which an inner space for housing an electronic component is formed between a base and a lid body, and the base and the lid body are bonded, the method comprising:
- preparing the lid body having a groove on a surface to be bonded with the base;
- housing the electronic component in the inner space;
- bonding the lid body to a bonding surface of the base in a portion except for an unbonded portion including at least a part of the groove in a predetermined bonding region of the base and the lid body in a state in which the inner space and an outside communicate with each other through the groove;
- and
- closing the unbonded portion by energy beam welding in a state in which a part of an irradiation range of an energy beam is positioned outside the bonding surface in a plan view seen from a side of the base to which the lid body is bonded.
A method of manufacturing an electronic device in which an inner space for housing an electronic component is formed between a base and a lid body, and the base and the lid body are bonded, the method comprising:
- preparing the lid body having a groove on a surface to be bonded with the base;
- housing the electronic component in the inner space;
- bonding the lid body to a bonding surface of the base by a bonding material in a portion except for an unbonded portion including at least a part of the groove in a predetermined bonding region of the base and the lid body in a state in which the inner space and an outside communicate with each other through the groove and a part of the bonding material is exposed from the lid body in a plan view seen from a side of the base to which the lid body is bonded;
- and
- closing the unbonded portion by energy beam welding in a state in which a part of an irradiation range of an energy beam overlaps with the portion of the bonding material exposed from the lid body in the plan view.
An electronic device in which an inner space for housing an electronic component is formed between a base and a lid body, and the base and the lid body are bonded,
- wherein the lid body has a groove which is formed on a surface to be bonded with the base and closed by a melting portion formed by melting a part of the lid body, and
- in a plan view, the melting portion is positioned between an concave portion provided on a side surface of the base and the inner space.
Dependencies are inferred from the claim text.