Automatic programming of solder paste inspection system
AssigneeCyberOptics Corporation
InventorsDouglas G. Butler, Carl E. Haugan
Life of this patent
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Abstract
A system for measuring solder paste stencil aperture positions and sizes is provided. The system includes at least one camera configured to acquire images of the stencil and an alignment target. A motion system generates relative motion between the at least one camera and the stencil. A controller is coupled to and controls the motion system. The controller is configured to analyze the images to generate aperture information relative to the stencil. The aperture information is provided to automatically program a solder paste inspection system. Other features and benefits that characterize embodiments of the present invention will be apparent upon reading the following detailed description and review of the associated drawings.
Claims18
A system for measuring solder paste stencil aperture positions and sizes, the system comprising:
- at least one camera configured to acquire images of the stencil and an alignment target;
- a motion system to generate relative motion between the at least one camera and the stencil;
- a vision processor being configured to analyze the images to generate aperture information relative to the stencil;
- and
- wherein the aperture information is provided to automatically program a solder paste inspection system.
A system for measuring solder paste stencil aperture positions and sizes, the system comprising:
- a first camera configured to view the stencil;
- a second camera fixedly mounted relative to the first camera and configured to view an alignment target;
- a motion system to generate relative motion between the cameras and the stencil;
- and
- a vision processor coupled to the first and second cameras, the vision processor being configured to capture and analyze images from the first and second cameras, and to calculate a position of the camera and the stencil apertures using image content.
A method of automatically mosaicking a series of images acquired of a stencil within a solder paste printer, the method comprising:
- acquiring a set of images of the stencil;
- acquiring a set of images of an alignment target having more details than the stencil, the alignment target having a fixed relationship relative to the stencil and wherein an orientation between the two sets of images is known accurately;
- mosaicking the set of alignment target images;
- and
- mosaicking the set of stencil images based at least in part on the mosaicked alignment target image.
Dependencies are inferred from the claim text.