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US 2014/0210569 A1Published application
Module substrate and module
AssigneeTayo Yuden Co., Ltd.
InventorsNaoyuki TASAKA, Tooru TAKEZAKI, Ken SASAKI
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Abstract
A module substrate includes: a multilayered wiring substrate that includes wiring layers; and embedded duplexers that are embedded in the multilayered wiring substrate and electrically connected to the wiring layers, wherein the embedded duplexers include duplexers supporting at least two bands of Band1, Band2, Band5, and Band8.
Claims9
A module substrate comprising:
- a multilayered wiring substrate that includes wiring layers;
- and
- embedded duplexers that are embedded in the multilayered wiring substrate and electrically connected to the wiring layers, wherein
- the embedded duplexers include duplexers supporting at least two bands of Band1, Band2, Band5, and Band8.
1 more element
Dependencies are inferred from the claim text.