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US 2014/0210499 A1Published application
Increasing current carrying capability through direct liquid cooling of test contacts
AssigneeIntel Corporation
InventorsWarren S. Crippen, Brett Grossman, Roy E. Swart, Pooya Tadayon
Life of this patent
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Abstract
Testing methods and systems are described. One method for testing an electronic device includes providing a probe in electrical contact with a device. The method also includes positioning an interface of the probe and the device in a liquid medium. The method also includes transmitting a current from the probe through the interface while the interface is in the liquid medium. Other embodiments are described and claimed.
Claims23
A method for testing an electronic device, comprising:
- providing a probe in electrical contact with a device;
- positioning an interface of the probe and the device in a liquid medium;
- and
- transmitting a current from the probe through the interface while the interface is in the liquid medium.
1 more element
A method comprising:
- positioning a plurality of test probes in electrical contact with a device, the test probes each having a length;
- and
- conducting electrical testing of the device while at least a portion of the length of the test probes is in a liquid medium.
A system comprising:
- an electronic device including contact regions;
- a testing mechanism including a plurality of probes, the probes adapted to touch the contact regions during electrical testing;
- a container, wherein the container is adapted to house the contact regions and at least a portion of the probes in a liquid medium during testing.
Dependencies are inferred from the claim text.