Chip-to-chip signal transmission system and chip-to-chip capacitive coupling transmission circuit
AssigneeI-Shou University
InventorsYu-Jung Huang, Ming-Kun Chen, Kai-Jen Liu
Life of this patent
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AssigneeI-Shou University
InventorsYu-Jung Huang, Ming-Kun Chen, Kai-Jen Liu
Estimating the term…
A chip-to-chip signal transmission system is provided, which includes a first chip, a second chip, and a dielectric layer. A signal transmission is performed between a transmitter of the first chip and a receiver of the second chip through a transmission-metal-pad unit and a receiving-metal-pad unit. The transmitter transmits a transmission-testing-coupling signal through the transmission-metal-pad unit according to a driving-testing signal when the transmitter receives the driving-testing signal. A first testing unit receives the transmission-testing-coupling signal and outputs a transmission-testing signal according to the transmission-testing-coupling signal. A second testing unit transmits a receiving-testing-coupling signal through the receiving-metal-pad unit according to the driving-testing signal when the second testing unit receives the driving-testing signal. The receiver receives the receiving-testing-coupling signal and outputs a receiving-testing signal according to the receiving-testing-coupling signal.
A chip-to-chip signal transmission system, comprising:
A chip-to-chip capacitive coupling transmission circuit, disposed on a chip, the chip-to-chip capacitive coupling transmission circuit comprising:
Dependencies are inferred from the claim text.