ULTRA THIN PoP PACKAGE
AssigneeApple Inc.
InventorJun Zhai
Life of this patent
Estimating the term…
Abstract
A PoP (package-on-package) package includes a bottom package coupled to a top package. The bottom package includes a die coupled to an interposer layer with an adhesive layer. One or more terminals are coupled to the interposer layer on the periphery of the die. The terminals and the die are at least partially encapsulated in an encapsulant. The terminals and the die are coupled to a redistribution layer (RDL). Terminals on the bottom of the RDL are used to couple the PoP package to a motherboard or a printed circuit board (PCB). One or more additional terminals couple the interposer layer to the top package. The additional terminals may be located anywhere along the surface of the interposer layer.
Claims20
A semiconductor device package, comprising:
- a redistribution layer;
- an encapsulant above the redistribution layer;
- an interposer layer above the encapsulant;
- a die at least partially enclosed in the encapsulant, wherein the die is coupled to an upper surface of the redistribution layer and a lower surface of the interposer layer;
- and
- one or more terminals coupling at least part of the interposer layer to at least part of the redistribution layer, wherein the terminals are located in the encapsulant on a periphery of the die.
A method for forming a semiconductor device package, comprising:
- providing an interposer layer with one or more first terminals coupled to a first side of the interposer layer;
- coupling a die to the first side of the interposer layer with the terminals located on a periphery of the die;
- at least partially encapsulating the die and the terminals in an encapsulant;
- and
- coupling a redistribution layer to the die and the terminals.
A semiconductor device package, comprising:
- a mold material positioned between an interposer layer and a redistribution layer;
- a die at least partially enclosed in the mold material, wherein the die is coupled to the interposer layer and the redistribution layer;
- and
- one or more terminals coupling the interposer layer to the redistribution layer, wherein the terminals are located in the mold material on a periphery of the die.
Dependencies are inferred from the claim text.