Die package with Openings Surrounding End-portions of Through Package Vias (TPVs) and Package on Package (PoP) Using the Die Package

A semiconductor device comprising:

• a semiconductor die;
• one or more dielectric layers adjacent the semiconductor die;
• one or more through package vias (TPVs) disposed in the one or more dielectric layers, the one or more TPVs extending from first side of the one or more dielectric layers to a second side of the one or more dielectric layers;
• and
• recesses in the one or more dielectric layers surrounding corresponding ends of the one or more TPVs, the recesses exposing at least a portion of sidewalls of corresponding ends of the one or more TPVs.

A semiconductor device comprising:

• a first die package, wherein the first die package comprises:
• a first semiconductor die;
• dielectric material on opposing sides of the first semiconductor die;
• and
• a through via (TV) in the dielectric material, wherein an opening in the dielectric material surrounds an end portion of the TV to expose the end portion;
• and
• a second die package, wherein the second die package comprises:
• a second semiconductor die;
• and
• an external connector;
• wherein the external connector of the second die package is bonded to the end portion of the TV of the first die package using solder to form a bonding structure, wherein the solder is at least partially within the opening.