Integrated circuit package with active interposer
AssigneeAltera Corporation
InventorsShuxian Chen, Jeffrey T. Watt
Life of this patent
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Abstract
An integrated circuit package may include a substrate and an interposer. The interposer is disposed over the substrate. The interposer may include embedded switching elements that may be used to receive different power supply signals. An integrated circuit with multiple logic blocks is disposed over the substrate. The switching elements embedded in the interposer may be used to select a power supply signal from the power supply signals and may be used to provide at least one circuit block in the integrated circuit with a selected power supply signal.
Claims21
An integrated circuit package comprising:
- a substrate;
- an interposer having a plurality of embedded switching elements disposed over the substrate, wherein the plurality of embedded switching elements are operable to receive a plurality of power supply signals;
- and
- an integrated circuit having a plurality of circuit blocks disposed over the substrate, wherein the plurality of embedded switching elements is operable to provide at least one circuit block of the plurality of circuit blocks with a selected power supply signal of the plurality of power supply signals.
An integrated circuit device comprising:
- an integrated circuit having a plurality of logic regions, wherein a first portion of the plurality of logic regions is operable to receive a first power supply signal and wherein a second portion of the plurality of logic regions is operable to receive a second power supply signal;
- and
- an interposer having a plurality of switching elements coupled to the integrated circuit, wherein a first switching element is operable to provide the first portion of the plurality of logic regions with the first power supply signal, and wherein a second switching element is operable to provide the second portion of the plurality of logic regions with the second power supply signal.
A method of packaging an integrated circuit, the method comprising:
- forming a plurality of switching elements in an interposer;
- mounting the interposer on a package substrate;
- and
- mounting an integrated circuit having a plurality of logic regions on the interposer, wherein each switching element of the plurality of switching elements is operable to provide the plurality of logic regions with a selected power supply signal through a plurality of interconnects.
Dependencies are inferred from the claim text.