Flip-chip hybridization of microelectronic components by local heating of connecting elements

A hybridized device comprising:

• a first microelectronic component provided on a surface with metal bumps;
• and
• a second microelectronic component provided on a surface with connection elements corresponding to said metal bumps, the metal bumps and the connection elements being mechanically attached,
• wherein the second microelectronic component comprises:
• a substrate;
• resistive elements at the longitudinal station of the connection elements;
• an electric insulator layer interposed between the resistive elements and the connection elements;
• and
• electric terminals for the application of an electric current in the resistive elements,
• and wherein the connection elements each comprise a metal well receiving the corresponding metal bump of the first microelectronic component, at least partially filled with a fusible element, particularly indium or an alloy of tin and gold, or of a conductive ink, particularly based on silver or copper.

A device intended to be hybridized with another device provided with metal bumps, comprising:

• a substrate;
• connection elements, arranged on a surface of the substrate and capable of being rigidly attached to said metal bumps, said elements each comprising a metal well having an opening capable of receiving the corresponding metal bump of the first microelectronic component and at least partially filled with a fusible element, particularly indium or an alloy of tin and gold, or with a conductive ink, particularly based on silver or copper;
• resistive elements at the longitudinal station of the connection elements;
• an electric insulator layer interposed between the resistive elements and the connection elements;
• and
• electric terminals for the application of an electric current in the resistive elements.