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US 2014/0210072 A1Published application
Semiconductor module
AssigneeToyota Jidosha Kabushiki Kaisha
InventorTadashi Tsukamoto
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Abstract
A semiconductor module includes a control board, and a shield plate arranged opposing the control board. A metal first heat dissipating portion is provided on a surface of the control board. A metal second heat dissipating portion is provided on a first surface of the shield plate, opposing the surface of the control board. A dielectric body is arranged between the first heat dissipating portion and the second heat dissipating portion.
Claims14
A semiconductor module comprising:
- a control board;
- and
- a shield plate arranged opposing the control board, wherein
- a first heat dissipating portion is made of metal and is provided on a surface of the control board;
- a second heat dissipating portion is made of metal and is provided on a first surface of the shield plate, the first surface opposing the surface of the control board;
- and
- a dielectric body is arranged between the first heat dissipating portion and the second heat dissipating portion.
4 more elements
Dependencies are inferred from the claim text.