GERMANIUM PHOTODETECTOR SCHOTTKY CONTACT FOR INTEGRATION WITH CMOS AND Si NANOPHOTONICS
AssigneeInternational Business Machines Corporation
InventorsSolomon Assefa, Jeffrey P. Gambino, Steven M. Shank
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AssigneeInternational Business Machines Corporation
InventorsSolomon Assefa, Jeffrey P. Gambino, Steven M. Shank
Estimating the term…
A method of forming an integrated photonic semiconductor structure having a photodetector device and a CMOS device may include depositing a dielectric stack over the photodetector device such that the dielectric stack encapsulates the photodetector. An opening is etched into the dielectric stack down to an upper surface of a region of an active area of the photodetector. A first metal layer is deposited directly onto the upper surface of the region of the active area via the opening such that the first metal layer may cover the region of the active area. Within the same mask level, a plurality of contacts including a second metal layer are located on the first metal layer and on the CMOS device. The first metal layer isolates the active area from the occurrence of metal intermixing between the second metal layer and the active area of the photodetector.
1-17. (canceled)
An integrated photonic semiconductor structure comprising:
A design structure tangibly embodied in a machine readable medium for designing, manufacturing, or testing an integrated circuit, the design structure comprising:
Dependencies are inferred from the claim text.