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US 2014/0209979 A1Published application
Metamorphic Growth Of III-V Semiconductor On Silicon Substrate By MOCVD for High Speed III-V Transistors
AssigneeNano and Advanced Materials Institute Limited
InventorsKei May LAU, Chak Wah TANG
Life of this patent
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Abstract
A III-V semiconductor device on a silicon substrate is constructed with a silicon (Si) substrate onto which gallium arsenide (GaAs) indium phosphide (InP) and aluminum indium arsenide (AlInAs) to form a structure of AlInAs over InP over GaAs over Si. The GaAs is applied in at least one layer over the Si, followed by at least one layer of InP and at least one layer of AlInAs. A portion of the structure is doped and a cap or passivation layer is applied.
Claims18
A method for manufacturing a III-V semiconductor device on a silicon substrate, the method comprising:
- preparing a silicon (Si) substrate;
- treating the substrate to form a stable As—Si prelayer on the substrate;
- applying at least one III/V semiconductor layer comprising a layer of gallium arsenide (GaAs);
- applying at least one layer of a second III/V semiconductor material comprising a layer of indium phosphide (InP);
- applying at least one layer of a material having a larger bandgap than said at least one III/V semiconductor layer, the material having a larger bandgap comprising a layer of aluminum indium arsenide (AlInAs), thereby forming a structure of AlInAs over InP over GaAs over Si;
- applying at least one layer of a material having a high electron mobility and small bandgap than said at least one III/V semiconductor layer, the material having a high electron mobility and small bandgap comprising a layer of Gallium indium arsenide (GaInAs), thereby forming a structure of GaInAs over AlInAs over InP over GaAs over Si;
- applying at least one layer of a material having a larger bandgap than said at least one III/V semiconductor layer, the material having a larger bandgap comprising a layer of aluminum indium arsenide (AlInAs), thereby forming a structure of AlInAs over GaInAs over InP over GaAs over Si;
- doping at least a portion of the structure, thereby forming a delta-doped layer at the AlInAs over GaInAs over InP over GaAs over Si;
- applying at least one layer of a material having a larger bandgap than said at least one III/V semiconductor layer, the material having a larger bandgap comprising a layer of aluminum indium arsenide (AlInAs), thereby forming a structure of AlInAs over delta-doped layer over AlInAs over GaInAs over InP over GaAs over Si;
- and
- applying at least one of a cap layer, thereby forming a heavy doped layer of GaInAs over AlInAs, as a contact layer, thereby forming a structure of heavy doped GaInAs over AlInAs over delta-doped layer over AlInAs over GaInAs over InP over GaAs over Si.
8 more elements
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Dependencies are inferred from the claim text.