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US 2014/0209961 A1Published application
Alternating current light emitting diode flip-chip
AssigneeLuxo-Led Co., Limited
InventorShih-Yang TSO
Life of this patent
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Abstract
An alternating current light emitting diode flip chip is provided. The flip chip includes an alternating current light emitting diode chip having a first bond pad and a second bond pad formed thereon. A first solder ball is disposed on the first bond pad and a second solder ball is disposed on the second bond pad. A flip-chip bonding process is performed to bond a carrier substrate with the first solder ball and the second solder ball.
Claims4
An alternating current light emitting diode flip-chip, comprising:
- an alternating current light emitting diode chip;
- a first bond pad disposed on the alternating current light emitting diode chip;
- a second bond pad disposed on the alternating current light emitting diode chip;
- a carrier substrate;
- a first solder ball, disposed between the first bond pad and the carrier substrate;
- and
- a second solder ball, disposed between the second bond pad and the carrier substrate.
4 more elements
Dependencies are inferred from the claim text.