Light-emitting element and manufacturing method thereof
AssigneeDelta Electronics, Inc.
InventorsLi-Fan LIN, Wen-Chia LIAO, Ching-Chuan SHIUE, Shih-Peng CHEN
Life of this patent
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Abstract
A light-emitting element includes two electrically conductive layers, a flexible insulating layer, a light-emitting chip and an encapsulating body. A groove is formed between the electrically conductive layers. The flexible insulating layer is disposed within the groove and links the electrically conductive layers. The light-emitting chip is placed on one of the electrically conductive layers or crossing over the flexible insulating layer. The light-emitting chip is electrically connected to the electrically conductive layers and covered by the encapsulating body.
Claims23
A light-emitting element comprising:
- two electrically conductive layers, a groove formed between the electrically conductive layers;
- a flexible insulating layer disposed within the groove and linking the electrically conductive layers;
- a light-emitting chip placed on one of the electrically conductive layers or crossing over the flexible insulating layer;
- and
- an encapsulating body covering the light-emitting chip.
A light-emitting element comprising:
- at least two first electrically conductive layers, a groove formed between the first electrically conductive layers;
- a flexible insulating layer disposed under the groove and linking the first electrically conductive layers;
- at least two second electrically conductive layers correspondingly disposed under the first electrically conductive layers, and a lower surface of each second conductive layer and a lower surface of the flexible insulating layer are at the same level;
- at least one light-emitting chip electrically connected to the first conductive layers;
- and
- an encapsulating body covering the light-emitting chip.
A manufacturing method for light-emitting element comprising:
- a) providing a first electrically conductive layer and a flexible insulating layer, the flexible insulating layer disposed under the first electrically conductive layer;
- b) forming at least one groove on the first electrically conductive layer;
- c) removing partially flexible insulating layer so that the first electrically conductive layer is at least partially exposed out of the flexible insulating layer;
- d) forming a second electrically conductive layer on the first electrically conductive layer exposed from the flexible insulating layer, and a lower surface of the second electrically conductive layer and a lower surface of the flexible insulating layer being at the same layer;
- e) disposing at least one light-emitting chip on the electrically conductive layer or crossing over the flexible insulating layer;
- and
- f) forming an encapsulating body covering the light-emitting chip.
A manufacturing method for light-emitting element comprising:
- a) providing an electrically conductive layer;
- b) forming at least one groove on the electrically conductive layer;
- c) disposing a flexible insulating layer within the groove;
- d) disposing at least one light-emitting chip on the electrically conductive layer or crossing over the flexible insulating layer, and
- e) forming an encapsulating body covering the light-emitting chip.
Dependencies are inferred from the claim text.