Light emitting diode package with oxidation-resistant metal coating layer

A light emitting diode (LED) package comprising:

• a substrate, comprising a top surface and a bottom surface at opposite sides thereof;
• a first electrode and a second electrode spaced from the first electrode, both the first and second electrodes penetrating downwardly through the substrate from the top surface to the bottom surface, a top end of each of the first and second electrodes being exposed at the top surface of the substrate, and a bottom end of each of the first and second electrodes being exposed at the bottom surface of the substrate;
• and
• an LED die arranged on the top surface of the substrate and electrically connected to the first and second electrodes, the LED die comprising a positive bonding pad and a negative bonding pad;
• wherein each of the first and second electrodes has a top face and a bottom face at opposite sides thereof, an oxidation-resistant metal coating layer is formed on the top face of at least one of the first and second electrodes, and at least one of the positive and negative bonding pads of the LED die is electrically connected to a corresponding one of the first and second electrodes via the oxidation-resistant metal coating layer.