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US 2014/0209946 A1Published application
Light emitting diode package and method for manufacturing the same
AssigneeHon Hai Precision Industry Co., Ltd.
InventorsYUN-YU CHOU, KO-HUA CHEN
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Abstract
An LED package includes a lens, an LED chip securely received and engaged in the lens, and a base with an electrode assembly thereon. A bottom surface of the LED chip is bare. The lens is mounted on the base and the bottom surface of the LED chip electrically and mechanically connects with the electrode assembly.
Claims14
An LED (light emitting diode) package comprising:
- a lens;
- an LED chip securely received and engaged in the lens and a bottom surface thereof being bare;
- and
- a base with an electrode assembly, the lens mounted on the base and the bottom surface of the LED chip electrically connecting with the electrode assembly.
1 more element
A method for manufacturing an LED package comprising following steps:
- providing an LED chip;
- providing a mold and arranging the LED chip in the mold;
- injecting a material with high light transmittance in the mold, the material enclosing the LED chip except a bottom surface of the LED chip, wherein the material in the mold form a lens, and the LED chip is securely received and engaged in the lens;
- removing the lens together with the LED chip from the mold;
- providing a base with an electrode assembly;
- and
- mounting the lens on the base to make the bottom surface of the LED chip electrically connect with the electrode assembly simultaneously.
4 more elements
Dependencies are inferred from the claim text.