Ceramic led package

A package for multiple LED's and for attachment to a substrate comprising:

• a body including:
• a top body layer;
• a cavity disposed through the top body layer and having a floor for bonding to the multiple LED's;
• and
• a thermal conduction layer bonded to the top body layer and having a top surface forming the floor of the cavity and a bottom surface, the thermal conduction layer including a thermally conducting ceramic material;
• a plurality of LED bonding pads in direct contact with the floor and configured to bond to the multiple LED's;
• and
• a plurality of electrical bonding pads in direct contact with the floor, coupled to the LED bonding pads, and in electrical communication with a plurality of electrical contacts disposed on a surface of the body.

A package for multiple LED's and for attachment to a substrate comprising:

• a body including:
• a top body layer, the top body layer comprising a metal material;
• a cavity surrounded by the top body layer and having a floor for bonding to the multiple LED's;
• and
• a thermal conduction layer bonded to the top body layer and having a top surface forming the floor of the cavity and a bottom surface, the thermal conduction layer including a thermally conducting ceramic material disposed between the floor and the bottom surface;
• a plurality of LED bonding pads in direct contact with the floor and configured to bond to the multiple LED's;
• and
• a plurality of electrical bonding pads in direct contact with the floor, proximate to the LED bonding pads, and in electrical communication with a plurality of electrical contacts disposed on a bottom surface of the body.

A package for multiple LED's and for attachment to a substrate comprising:

• a body including:
• a top body layer, the top body layer comprising a metal material;
• a cavity surrounded by the top body layer and having a floor for bonding to the multiple LED's;
• and
• a thermal conduction layer bonded to the top body layer and having a top surface forming the floor of the cavity and a bottom surface, the thermal conduction layer including a thermally conducting ceramic material disposed between the floor and the bottom surface;
• a plurality of LED bonding pads in direct contact with the floor and configured to bond to the multiple LED's;
• a plurality of electrical bonding pads in direct contact with the floor, proximate to the LED bonding pads, and in electrical communication with a plurality of electrical contacts disposed on a bottom surface of the body;
• and
• a transparent encapsulation layer.