Package-free and circuit board-free led device and method for fabricating the same
OwnerChung-Lin Wanginventor
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Abstract
The present invention discloses a package-free and circuit board-free LED device and a method for fabricating the same. The LED device is exempted from the semiconductor package substrate and the printed circuit board and comprises at least one LED chip having two electrodes able to directly connect with external wires and at least one chip unit. A DC power or an AC power is directly electrically connected with the two electrodes through wires to drive the LED device to emit light. The present invention minimizes device components and fabrication steps, effectively reduces cost and promotes reliability and yield.
Claims9
A package-free and circuit board-free light emitting diode device comprising at least one light emitting diode (LED) chip, which comprises:
- an LED chip having two electrodes able to connect with external wires and at least one chip unit, wherein a photolithographic technology and chip processes are used to fabricate said electrodes, and wherein a DC power or an AC power is directly electrically connected with said two electrodes through said external wires to drive said LED device to emit light.
A method for fabricating a package-free and circuit board-free light emitting diode device, comprising steps:
- providing a light emitting diode (LED) chip, wherein a photolithographic technology and chip processes are used to fabricate two electrodes able to directly connect with external wires and at least one chip unit on said LED chip;
- and
- electrically connecting a power with said two electrodes through said external wires to drive said LED device to emit light.
Dependencies are inferred from the claim text.