US 2014/0209930 A1 · Multi-Vertical LED Packaging Structure

Abstract

The present disclosure involves a light-emitting diode (LED) packaging structure. The LED packaging structure includes a submount having a substrate and a plurality of bond pads on the substrate. The LED packaging structure includes a plurality of p-type LEDs bonded to the substrate through a first subset of the bond pads. The LED packaging structure includes a plurality of n-type LEDs bonded to the substrate through a second subset of the bond pads. Some of the bond pads belong to both the first subset and the second subset of the bond pads. The p-type LEDs and the n-type LEDs are arranged as alternating pairs. The LED packaging structure includes a plurality of transparent and conductive components each disposed over and electrically interconnecting one of the pairs of the p-type and n-type LEDs. The LED packaging structure includes one or more lenses disposed over the n-type LEDs and the p-type LEDs.

Claims20

Dependent claims

A light-emitting diode (LED) packaging structure, comprising:

a submount substrate;
a plurality of conductive pads located on the submount substrate;
and
a plurality of LEDs bonded to the submount substrate through the plurality of conductive pads, wherein the plurality of LEDs includes p-type vertical LEDs and n-type vertical LEDs that are arranged in an alternating manner;
wherein:
the p-type and n-type vertical LEDs each include a respective p-type doped semiconductor layer and an n-type doped semiconductor layer;
for the p-type vertical LED, the p-type doped semiconductor layer is located closer to the submount substrate than the n-type doped semiconductor layer;
and
for the n-type vertical LED, the n-type doped semiconductor layer is located closer to the submount substrate than the p-type doped semiconductor layer.

6 more elements

A method of packaging light-emitting diodes (LEDs), the method comprising:

fabricating a plurality of p-type vertical LEDs;
fabricating a plurality of n-type vertical LEDs;
bonding the p-type vertical LEDs and the n-type vertical LEDs to a submount;
and
forming a plurality of transparent cladding layer (TCL) components over the p-type and n-type vertical LEDs, each TCL component electrically interconnecting one of the p-type vertical LEDs with one of the n-type vertical LEDs.

2 more elements

Dependencies are inferred from the claim text.

Multi-Vertical LED Packaging Structure

Life of this patent

Multi-Vertical LED Packaging Structure

Life of this patent

Abstract

Claims20