Light source assembly and a process for producing a light source assembly
AssigneeThe Silanna Group Pty Ltd
InventorsAnnette Teng, Steven Grant Duvall
Life of this patent
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Abstract
A light source assembly, including one or more light emitting diodes disposed within a hermetically sealed enclosure, wherein the light emitting diodes are in the form of one or more unpackaged planar semiconductor dies mounted on an inner surface of a wall of the enclosure, wherein the wall of the enclosure includes electrically conductive tracks that connect electrical contacts of the unpackaged planar semiconductor dies to corresponding electrical contacts external of the sealed enclosure.
Claims24
A light source assembly, including one or more light emitting diodes disposed within a hermetically sealed enclosure, wherein the light emitting diodes are in the form of one or more unpackaged planar semiconductor dies mounted on an inner surface of a wall of the enclosure, wherein the wall of the enclosure includes electrically conductive tracks that connect electrical contacts of the unpackaged planar semiconductor dies to corresponding electrical contacts external of the sealed enclosure.
A light source assembly, including one or more light emitting diodes disposed within a hermetically sealed enclosure, wherein the light emitting diodes are in the form of one or more unpackaged planar semiconductor dies mounted in respective openings in a wall of the enclosure such that the enclosure is formed in part by the unpackaged planar semiconductor dies, and wherein the wall of the enclosure includes electrically conductive tracks that connect electrical contacts of the unpackaged planar semiconductor dies to corresponding electrical contacts external of the sealed enclosure.
A process for producing a light source assembly, including:
- forming electrically conductive tracks on a substrate;
- mounting one or more light emitting diodes in the form of one or more unpackaged planar semiconductor dies to the substrate such that the electrically conductive tracks are electrically connected to electrical contacts of each unpackaged planar semiconductor die;
- and
- hermetically sealing the unpackaged planar semiconductor dies within an enclosure formed in part by the substrate.
Dependencies are inferred from the claim text.