Semiconductor device
AssigneeSK hynix Inc.
InventorTake Kyun WOO
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Abstract
A semiconductor device is disclosed allowing detection of a connection state of a Through Silicon Via (TSV) at a wafer level. The semiconductor device includes a first line formed over a Through Silicon Via (TSV), a second line formed over the first line, and a first power line and a second power line formed over the same layer as the second line. Therefore, the semiconductor device can screen not only a chip-to-chip connection state after packaging completion, but also a connection state between the TSV and the chip at a wafer level, so that unnecessary costs and time encountered in packaging of a defective chip are reduced.
Claims16
A semiconductor device comprising:
- a first line electrically coupled to a Through Silicon Via (TSV), and formed over the TSV;
- a second line electrically coupled to the first line, and formed over the first line;
- a first power line and a second power line formed over the TSV in a manner that the first and second power lines overlie the TSV;
- and
- a test unit configured to detect a current flowing between the first power line and the second power line.
Dependencies are inferred from the claim text.