Semiconductor device and method for manufacturing semiconductor device

A method for manufacturing a semiconductor device comprising a pixel portion and a driver circuit portion, comprising:

• forming a first conductive layer in the pixel portion and the driver portion;
• forming a first insulating layer over the first conductive layer in the pixel portion and the driver portion;
• forming an oxide semiconductor layer over the first insulating layer in the pixel portion and the driver portion;
• forming a second insulating layer over and in contact with a part of the oxide semiconductor layer in the pixel portion and the driver portion;
• forming a second conductive layer and a third conductive layer over the second insulating layer and the oxide semiconductor layer in the pixel portion and the driver portion;
• forming a fourth conductive layer electrically connected to one of the second conductive layer and the third conductive layer in the pixel portion;
• and
• forming a fifth conductive layer overlapping the first conductive layer in the driver circuit portion,
• wherein the fourth conductive layer and the fifth conductive layer are formed on a same surface.

A method for manufacturing a semiconductor device comprising a pixel portion and a driver circuit portion, comprising:

• forming a first conductive layer in the pixel portion and the driver circuit portion;
• forming a first insulating layer over the first conductive layer in the pixel portion and the driver circuit portion;
• forming an oxide semiconductor layer over the first insulating layer in the pixel portion and the driver circuit portion;
• forming a second insulating layer over and in contact with a part of the oxide semiconductor layer in the pixel portion and the driver circuit portion;
• forming a second conductive layer and a third conductive layer over the second insulating layer and the oxide semiconductor layer in the pixel portion and the driver circuit portion;
• forming a third insulating layer over the second conductive layer and the third conductive layer in the pixel portion and the driver circuit portion;
• forming a fourth conductive layer electrically connected to one of the second conductive layer and the third conductive layer in the pixel portion;
• and
• forming a fifth conductive layer overlapping the first conductive layer in the driver circuit portion,
• wherein the fourth conductive layer and the fifth conductive layer are formed on a same surface.