Method for bonding heat-conducting substrate and metal layer
AssigneeSubtron Technology Co., Ltd.
InventorChien-Ming Chen
Life of this patent
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Abstract
A method for bonding a heat-conducting substrate and a metal layer is provided. A heat-conducting substrate, a first metal layer and a preformed layer are provided. The preformed layer is between the heat-conducting substrate and the first metal layer. The preformed layer is a second metal layer or a metal oxide layer. A heating process is performed to the preformed layer in an oxygen-free atmosphere to convert the preformed layer to a bonding layer for bonding the heat-conducting substrate and the first metal layer. The temperature of the heating process is less than or equal to 300° C.
Claims13
A method for bonding a heat-conducting substrate and a metal layer, comprising:
- providing a heat-conducting substrate, a first metal layer and a preformed layer, wherein the preformed layer is located between the heat-conducting substrate and the first metal layer, and the preformed layer is a second metal layer;
- and
- performing a heating process to the preformed layer in an oxygen-free atmosphere, to convert the preformed layer to a bonding layer to bond the heat-conducting substrate and the first metal layer, wherein the temperature of the heating process is less than or equal to 300° C.
Dependencies are inferred from the claim text.