Method of manufacturing an electronic device

A method of manufacturing an electronic device, the electronic device including:

• a laser diode that emits laser light when energized;
• a first member supporting the laser diode;
• a second member to which the first member is bonded, the second member having a waveguide allowing the laser light to propagate through;
• and
• a bonding layer bonding the first member and the second member together, wherein
• the bonding layer includes a bonding material layer made of a bonding material that melts when heated to a predetermined melting temperature or higher, and
• the waveguide has an incidence end on which the laser light emitted from the laser diode is to be incident,
• the method comprising:
• a positioning step of positioning the first member with respect to the second member with a preliminary bonding layer interposed between the first member and the second member before being bonded together so that the laser light emitted from the laser diode will be incident on the incidence end of the waveguide, the preliminary bonding layer including the bonding material and being configured to later become the bonding layer;
• a bonding step of bonding the first member and the second member together after the positioning step;
• and
• a checking step of checking the accuracy of positioning of the first member with respect to the second member after the bonding step, wherein
• in the positioning step, the laser diode is energized to allow the laser diode to emit laser light, the laser light is allowed to be incident on the incidence end of the waveguide, a parameter value corresponding to the intensity of light having been incident on the incidence end and propagated through the waveguide is detected, and a position of the first member with respect to the second member is determined based on the value detected,
• in the bonding step, the first member is irradiated with heating light without energizing the laser diode, the bonding material included in the preliminary bonding layer is thereby heated and melted with the heating light, and thereafter the irradiation of the first member with the heating light is stopped to allow the bonding material to solidify so that the preliminary bonding layer becomes the bonding layer, and
• in the checking step, the laser diode is energized again to allow the laser diode to emit laser light, the laser light is allowed to be incident on the incidence end of the waveguide, a parameter value corresponding to the intensity of light having been incident on the incidence end and propagated through the waveguide is detected, and the accuracy of positioning of the first member with respect to the second member is checked based on the value detected.