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US 2014/0209579 A1Published application
Device for cutting sapphire substrate
AssigneeHon Hai Precision Industry Co., Ltd.
InventorsGA-LANE CHEN, CHUNG-PEI WANG
Life of this patent
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Abstract
A pulse-operated laser emitting device for cutting a sapphire substrate includes a picoseconds laser for emitting a laser beam and a collimator lens positioned in a path of the laser beam and which cuts the sapphire substrate cleanly so as not to require any grinding or polishing processes afterwards.
Claims10
A device for cutting a sapphire substrate, the device comprising:
- a picoseconds laser for emitting a laser beam;
- and
- a collimator lens positioned in a path of the laser beam and for collimating the laser beam to produce a collimated laser beam for cutting.
Dependencies are inferred from the claim text.