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US 2014/0209468 A1Published application
Systems and methods for tin antimony plating
AssigneeThe Boeing Company
InventorThomas A. Woodrow
Life of this patent
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Abstract
Systems and methods for tin antimony plating are provided. One plating method includes doping a tin (Sn) plating solution with antimony (Sb). One method also includes electroplating a component using the antimony-doped tin plating. The antimony-doped tin plating formed by one method includes between about 1% and about 3% antimony.
Claims20
A plating method comprising:
- doping a tin (SO plating solution with antimony (Sb);
- and
- electroplating a component using the antimony-doped tin plating.
A method for tin plating a component, the method comprising:
- producing an electrolyte by:
- dissolving tin sulfate in deionized water;
- filtering the tin sulfate solution to obtain a clear solution that becomes cloudy upon sitting;
- stirring into the cloudy solution an amount of sulfuric acid to provide a clear solution;
- stirring a surfactant into the solution;
- stirring a formaldehyde solution into the solution;
- stirring a benzyl alcohol into the solution to obtain a clear, colorless solution;
- and
- heating the solution to about 75° C. in a water bath;
- preparing an antimony solution by dissolving an amount of antimony powder in sulfuric acid with heating and stirring;
- and
- adding an amount of the antimony solution to the electrolyte being maintained at about 75° C.
9 more elements
A tin (Sn) plating doped with between about 1% and about 3% of antimony (Sb).
Dependencies are inferred from the claim text.