Pcb having offset differential signal routing

A method for reducing crosstalk in a printed circuit board, the method comprising the steps of:

• routing a first electrical signal trace along a first direction;
• disposing an electrically conductive layer below the first electrical signal trace along a second direction that is perpendicular to the first direction, the electrically conductive layer extending along a plane that is normal to the second direction;
• spacing at least one electrically conductive signal via from at least one electrically conductive ground via along the first direction in a first linear array;
• spacing at least one electrically conductive signal via and at least one electrically conductive ground via along the first direction in a second linear array that is spaced from the first linear array along a third direction that is perpendicular to the first direction and the second direction, such that the first linear array and the second linear array are consecutive linear arrays along the third direction, and the first electrical signal trace is disposed between the first and second linear arrays with respect to the second direction;
• and
• placing a group of ground isolation vias arranged along the first direction, the group of ground isolation vias being disposed between the first electrical signal trace and the second linear array.

A method for reducing crosstalk in a printed circuit board, the method comprising the steps of:

• providing or teaching to a third party the use of the printed circuit, the printed circuit board including:
• a first electrical signal trace elongate along a first direction;
• an electrically conductive layer disposed below the first electrical signal trace along a second direction that is perpendicular to the first direction, the electrically conductive layer extending along a plane that is normal to the second direction;
• a first linear array oriented along the first direction, the first linear array including at least one electrically conductive signal via and at least one electrically conductive ground via;
• a second linear array oriented along the first direction, the second linear array include at least one electrically conductive signal via and at least one electrically conductive ground via, the second linear array spaced from the first linear array along a third direction that is perpendicular to the first direction and the second direction, the first linear array and the second linear array being consecutive linear arrays along the third direction, the first electrical signal trace being disposed between the first and second linear arrays with respect to the second direction;
• and
• a group of ground isolation vias, the ground isolation vias of the group of ground isolation vias arranged along the first direction, the group of ground isolation vias being disposed between the first electrical signal trace and the second linear array,
• teaching to the third party the step of mounting a complementary electrical connector to the printed circuit board such that (1) a mounting portion of an electrical signal contact of the complementary electrical connector is inserted into one of the electrically conductive signal vias, (2) a mounting portion of a ground contact of the complementary electrical connector is inserted into one of the electrically conductive ground vias, and (3) no mounting portions of electrical contacts of the complementary electrical is aligned with any of the ground isolation vias;
• and
• selling to the third party the printed circuit board.